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Wednesday, August 27, 2008

Manufacturing Chain August 2008

Oerlikon Solar to create 350 jobs in Switzerland (8/26/2008)
Fire causes heavy damage in battery factory (8/22/2008)
Spansion, SMIC ink 43-nm foundry deal (8/21/2008)
Green light for Bosch-Samsung battery JV (8/18/2008)
Infineon chip causing problems on iPhone (8/14/2008)
ASTM forms technical committee on sustainability (8/14/2008)
Fairchild Semiconductor creates global "green" design team (8/14/2008)
TSMC hikes capex for 40-nm, MEMS (8/13/2008)
ESD specialist opens R&D, manufacturing site (8/13/2008)
IQE adds to silicon wafer types (8/13/2008)
Plastic Logic draws on Dresden chip experience for pioneering venture (8/13/2008)
Korean LCD supplier starts producing in Poland (8/11/2008)
Schott AG to boost solar investments (8/11/2008)
Best practices drive up basic automotive semiconductor component reliability (8/08/2008)
Qimonda in talks with Elpida on joint manufacturing (8/08/2008)
Supply chain opportunities to address climate change passed over (8/08/2008)
Anadigics delays China fab investment (8/07/2008)
ST, STATS ChipPAC license Infineon packaging (8/07/2008)
Manufacturing pull still strong in CEE (8/07/2008)
Japanese company plans FED panel production by late 2009 (8/06/2008)
Elpida forms 300-mm fab venture in China (8/06/2008)
Semtech's plant in Mexico hit by fire (8/06/2008)
Hynix, Numonyx team up on NAND (8/05/2008)
Storm impacts MEMC's polysilicon production (8/05/2008)
BOM reduction enhances tire pressure monitoring (8/05/2008)
What you need to know about imaging solutions for camera phones (8/03/2008)
Growth slows down, consolidation continues in contract manufacturing (8/01/2008)
Growth slows down, consolidation continues in contract manufacturing (8/01/2008)

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